SI10US
特点
● 低CTE，高模量，可有效降低封装基板的翘曲● 优异的耐湿热性
● 良好的PCB加工性
● 无卤材料
应用领域
- eMMC, DRAM
- AP, PA
- Dual CM
- Fingerprint, RF Module
- 产品性能
- 产品证书
- 资料下载
| Items | Condition | Unit | SI10US |
|---|---|---|---|
| Tg | DMA | ℃ | 280 |
| Td | 5% wt. loss |
℃ |
＞400 |
| CTE (X/Y-axis) | Before Tg |
ppm/℃ |
10 |
|
CTE (Z-axis) |
α1/α2 |
ppm/℃ |
25/135 |
| Dielectric Constant 1) (1GHz) | 2.5.5.9 | - | 4.4 |
|
Dissipation Factor 1) (1GHz) |
2.5.5.9 | - | 0.007 |
| Peel Strength1) | 1/3 OZ, VLP Cu |
N/mm |
0.80 |
| Solder Dipping | @288℃ | min | >30 |
| Young's modulus | 50℃ | GPa | 26 |
|
Young's modulus |
200℃ |
GPa |
23 |
| Flexural Modulus1) |
50℃ |
GPa |
32 |
|
Flexural Modulus1) |
200℃ |
GPa |
27 |
|
Water Absorption1) |
A | % | 0.14 |
| Water Absorption1) | 85℃/85%RH，168Hr |
% |
0.35 |
|
Flammability |
UL-94 |
Rating |
V-0 |
| Thermal Conductivity | - | W/(m.K) | 0.61 |
| Color | - | - | Black |
Remarks:
*Specimen thickness: 0.10mm. Test method is according to IPC-TM-650.
*1): specimen thickness: 0.80mm.
All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co.,Ltd. fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co.,Ltd.