SP175M
特点
● 无铅兼容● 优良的耐热可靠性
● 低的Z轴热膨胀系数
● 低吸水率
应用领域
● 适用于高厚径比和高多层PCB
● 广泛应用于计算机、通讯设备、精密仪器、仪器仪表、路由器等
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| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 175 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 348 |
|
T288 |
2.4.24.1 | TMA | min | 20 |
| T260 |
2.4.24.1 |
TMA |
min |
60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | ＞60s No Delamination |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 56 |
| After Tg | ppm/℃ | 326 | ||
| 50-260℃ | % | 3.8 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 3.6 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.0164 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 4.6 x 106 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 7.9 x 105 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 90 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 45+kV NB |
| Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.3 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.20 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| CTI | IEC60112 | A | Rating | PLC3 |
Remarks:
1. Specimen thickness: 1.8mm. Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.