Synamic8GN
特点
● 低Dk/Df (10GHz): 3.28/0.0019
● 高Tg 200℃ (DMA)
● 更优异的热可靠性
● 更优异的耐离子迁移性能
● 更低的Z轴热膨胀系数，优异的通孔可靠性应用领域
● 超高速网络设备
● 服务器、交换机、存储、路由器等
● 高性能计算机
● 高频测量仪器等
● 光通信产品
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 200 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 430 |
|
T288 |
2.4.24.1 | TMA | min | >120 |
| T300 |
2.4.24.1 |
TMA |
min |
>120 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 45 |
| After Tg | ppm/℃ | 230 | ||
| 50-260℃ | % | 2.2 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.35 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.28 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.49 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0008 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0019 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0021 | |
| Peel Strength (1Oz, RTF2/HVLP2) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.82/0.80 [4.7/4.6] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks:
1. Allthe typical value is based on the 30mil (6*2116) thickness specimen, but not guaranteedata.
2. All the typicalvalue listed above is for your reference only, please turn to ShengyiTechnology Co., Ltd. for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.