LNB33C
特点
● 玻璃布增强碳氢化合物和陶瓷电介质● 减少PIM
● 各频率下稳定的电气特性
● 低Z轴膨胀系数和出色的尺寸稳定性
● 无铅工艺兼容性
应用领域
● 高频无线通信● 蜂窝基站天线
● WiMAX天线网络
- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit |
Direction |
Typical Value |
| Dielectric Constant, Dk | IPC-TM-650 2.5.5.5 | C-24/23/50, 10GHz | - | Z | 3.30±0.05 |
| Dielectric Constant, Dk | IPC-TM-650 2.5.5.15 | C-24/23/50, 10GHz | - | X/Y | 3.56±0.05 |
| Dissipation Factor, Df | IPC-TM-650 2.5.5.15 | C-24/23/50, 10GHz | - | X/Y | 0.0030 |
| Thermal Coefficient of Dk | IPC-TM-650 2.5.5.5 | -55 to 85℃ | ppm/℃ | Z | +50 |
| PIM |
43dBM
1900MHz
|
50 ohm
0.0307"
|
dBc | -158 | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | COND A | MΩ·cm | 6.8 x 108 | |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | COND A | MΩ | 5.3 x 107 | |
| Flexual Strength | IPC-TM-650 2.4.4 | R.T. | MPa | X/Y | 200/160 |
| CTE | IPC-TM-650 2.4.24 | 50~260℃ | ppm/℃ | Z | 55 |
| IPC-TM-650 2.4.41 | 50~260℃ | ppm/℃ | X/Y | 12/12 | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | ＞280 | |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% wt. loss) | ℃ | 400 | |
| Thermal Conductivity | ASTM D5470 | 50℃ | W/(m·k) | Z | 0.65 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.05 | |
| Peel Strength (1oz HVLP) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.05 [6.0] | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
Remarks:
1. All the typical value is based on the 0.780(0.0307") thickness specimen, but not guarantee data.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.