SF325B
特点
● 粘接强度高。
● 不含卤素，阻燃性达到UL94 VTM-0级。
● 优秀的耐热性、耐化学性和电性能。
● 优异的耐离子迁移性，不长枝状结晶。
● 溢胶量低，加工性好，适于快速压合和传统压合。
● 满足RoHS指令要求，不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。
应用领域
多层挠性印制板和刚挠性印制板等用粘接膜- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.7 |
| 288℃, 5s | 1.6 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
96.2 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
8.0×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
8.5×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.4 |
| Dissipation Factor (10GHz) | SPDR | C-24/23/50 | - | 0.017 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm |
＜0.15 |
|
Flammability |
UL94 |
E-24/125 |
Rating |
VTM-0 |
Remarks:
*Testing after laminating with shining side of copper foil and PI film insuitable condition.
1.Certified to IPC-4203/20 Unsupportedpolyester adhesive
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.