S1125
特点
● 不含卤素，Dicy 固化 普通Tg 。
● 不含锑、红磷等成分。
● 优异的表面粘结性。
应用领域
手机、电脑、仪器仪表、摄录机、通讯设备等- 产品性能
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| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 130 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 350 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 40 | |
|
After Tg |
ppm/℃ | 235 | |||
| 50-260℃ |
% |
3 | |||
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
| Thermal Stress | IPC-TM-650 2.4.24.13 | 288℃, solder dip | -- | >100S | |
| Flexural strength |
IPC-TM-650 2.4.4 |
A |
Mpa |
580/LW | |
| A |
Mpa |
450/CW | |||
| Peel Strength | IPC-TM-650 2.4.8 | Copper (1/2 oz) | N/mm | 1.2 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| Flammability | UL94 |
E-24/125 |
Rating |
V-0 |
|
Remarks:
1. Performance data based on the sample S1125 0.30mm test results.
2.The test method of PS: superposition the ED copper foil (1Oz),bonding film, S1125, then laminate them, using the pararmeters 170℃, 200PSI, 40 minutes. Using 90 degree angle peelling.
3. All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.