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Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar
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Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar
Flexible copper clad laminate
Coverlay
No-flow prepreg
Stiffener
Bonding film
PET laminated busbar
Input Specification Values
Dk/10GHz
===Please Select===
≥4.0
3.5≤--＜4.0
3.0≤--＜3.5
2.5≤--＜3.0
＜2.5
Df/10GHz
===Please Select===
≥0.01
0.008≤--＜0.01
0.005≤--＜0.008
0.002≤--＜0.005
＜0.002
Application
===Please Select===
5G
WPC
Power battery protection board
CCM Module
Battery Module
Antenna Module
Cable?
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Product List
Join Contrast
Product Name
Product Description
Dk/10GHz
Df/10GHz
Application
SF206B
LowDk/Df Bonding film
2.5
0.003
5G
SF315B
Halogen-free type epoxy bonding film
3.4
0.02
Multilayer Module Rigid-Flex Module
SF325B
Anti-ion Migration type bonding film
3.4
0.017
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